Thermal Conductive Films & Adhesives
RAND Manufacturing provides precision die cutting and slitting services for thermal interface material (TIMS) types that are used in electronics to improve reliability and prevent premature failure. Examples include the die cut gap pads that are used between heat-generating electronic components and heat sinks or other substrates.
Types of Thermal Interface Material
RAND Manufacturing works with the following types of TIMs for today’s demanding applications.
- Thermal adhesives
- Thermal caulks
- Thermal PSAs
- Graphite films
- Thermal glues
- Silicone pads
Thermal Adhesives
Thermal Caulks
Thermal PSA
Thermally conductive pressure-sensitive adhesive tapes (PSA) are filled with ceramic or metallic powders and require initial contact pressure to conform to irregularities in mating surfaces. They differ in terms of peel strength, lap and die-shear strength, holding power, and thermal resistance.
Graphite Films
Thermal Glues
Thermal glues are usually made of zinc oxide and silicone, although some products contain liquid metal for a higher thermal conductivity. They are used to dissipate heat from a computer’s central processing unit (CPU) and transfer it to the surrounding air through a metal heat sink.
Silicone Pads
Die Cutting and Slitting for Thermal Interface Materials
RAND Manufacturing is ready to provide you with die cutting and slitting services for thermal interface materials at our ISO 9001:2015-certified manufacturing facility in Lakemoor, Illinois. We take quality seriously and are proud to be a Made in America manufacturer.
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